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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6512-B Issued Date : 1992.11.25 Revised Date : 2000.09.15 Page No. : 1/3
HSA1015
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSA1015 is designed for use in driver stage of AF amplifier and general purpose amplification.
Absolute Maximum Ratings
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 400 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... -50 V VCEO Collector to Emitter Voltage .................................................................................... -50 V VEBO Emitter to Base Voltage ............................................................................................ -5 V IC Collector Current ..................................................................................................... -150 mA
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. -50 -50 -5 120 25 80 Typ. Max. -100 -100 -300 -1.1 700 7 Unit V V V nA nA mV V Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-50V, IE=0 VEB=-5V, IC=0 IC=-100mA, IB=-10mA IC=-100mA, IB=-10mA VCE=-6V, IC=-2mA VCE=-6V, IC=-150mA VCE=-10V, IC=-1mA, f=100MHz VCB=-10V, f=1MHz, IE=0
MHz pF
*Pulse Test : Pulse Width 380us, Duty Cycle2%
Classification Of hFE1
Rank Range Y 120-240 GR 200-400 BL 350-700
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000.0 1
Spec. No. : HE6512-B Issued Date : 1992.11.25 Revised Date : 2000.09.15 Page No. : 2/3
Saturation Voltage & Collector Current
VBE(sat) @ IC=10IB 100.0
Saturation Voltage (V)
VCE=6V
hFE
0.1
10.0
VCE(sat) @ IC=10IB
1.0 0.1
0.01 1 10 100 1000 0.01 0.1 1 10 100 1000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
10.00 1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
VCE=10V 100
Capacitance (pF)
Cob
10
1.00 0.1
1 1 10 100 1 10 100 1000
Reverse-Biased Voltage (V)
Collector Current (mA)
Safe Operating Area
10000 PT=1ms 450 400
PD-Ta
Cpllector Current-IC (mA)
1000
PT=100ms
Power Dissipation-PD(mW)
350 300 250 200 150 100 50
PT=1s 100
10
1 1 10 100
0 0 50 100
o
150
200
Forward Biased Voltage-VCE (V)
Ambient Temperature-Ta( C)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A B
12 3
Spec. No. : HE6512-B Issued Date : 1992.11.25 Revised Date : 2000.09.15 Page No. : 3/3
2
Marking :
HSMC Logo Part Number Date Code Rank Product Series
3
Laser Mark
HSMC Logo Product Series
C
D
Part Number
H I E F
G
Ink Mark Style : Pin 1.Emitter 2.Collector 3.Base
1
3-Lead TO-92 Plastic Package HSMC Package Code : A
*:Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification


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